Research Area

VLSI / SoC Design, Test, Reliability, and Security

Research topics include SoC/3D IC design, production-oriented testing, robust security circuits, and memory test/repair methodologies.

VLSI SoC 3D IC Design Technology
01

VLSI / SoC / 3D IC Design Technology

  • Parallel Processing: Biomedical Processor, High-Performance Computing (HPC)
  • Artificial Intelligence (AI): AI accelerator, Deep Neural Network
  • Reliability: Automotive IC, High-Bandwidth Memory (HBM)
VLSI SoC 3D IC Testing Technology
02

VLSI / SoC / 3D IC Testing Technology

  • Test Methodology: Reduced Pin Count Test (RPCT), Massive Parallel Test (MPT)
  • Scan Test: Compression, Low Power Test, Diagnosis, Test Access Mechanism
  • Through Silicon Via (TSV): Test Structure, Test Optimization, TSV Repair
Hardware Security and Robust Design Methodology
03

Hardware Security and Robust Design Methodology

  • Security and Trust: Detection/Protection Circuits Against Physical Attacks
  • Design Methodology: Design-for-Testability, Design-for-Security, Design-for-Reliability
Memory Test and Repair Methodology
04

Memory Test and Repair Methodology

  • Memory Test: Built-in Self Test (BIST), 3D-DRAM Control, Built-off Self Test (BOST)
  • Memory Repair: Redundancy Analysis (RA), Built-in RA (BIRA), Built-in Self-Repair (BISR)